Here are some tips for handling large and fine pitch chips:

1. Make sure the PCB is fixed by the corner of the machine. Please also try to make sure the Jedec

tray parallel to the PCB if possible.

2. Use a suitable nozzle, for example, we use CN750 to handle TQFP100.

3. Lower the speed (to 40% for example)

4. You need to do a rough place test and check the offset.

Then adjust the coordinate according to the actual placement effect, if it's off in the X direction

by +0.1mm every time, then you can adjust the X value -0.1 to compensate.